Flip chip bonding technology is crystal electronics is one of the core technology, and compared to normal chip, flip chip has good heat dissipation function; at the same time, crystal electronics but also with the flip chip technology, adapt to the extension design, chip graphics design. Chip products with low voltage, high brightness, high reliability, high saturation current density and other advantages, can in the flip chip bonding substrate protection of integrated circuit chip, the reliability and performance of much help. And dress and vertical structure are compared, using flip-chip bonding method is easier to realize large power chip module, multiple functions integrated chip light source technology, in the LED chip module yield and performance have a greater advantage.

Source: Daily Economic News